I would recommend that you look at the “Type” of paste that you have. In addition to the solder composition, there is also a type, usually denoted T3, T4, T5 and this represents the size of the balls of solder suspended in the paste. “Type” is like wire gauge, the bigger the number, the smaller the balls.
I think that T3 is pretty typical paste but for larger geometries. For small apertures like DFNs or BGAs, the balls get jammed in the stencil and don’t stick to the pad. The also plug the holes for future wipes.
You might be using T3 paste…
I believe that you want to have T4 paste and this will make a big difference.
You might say “what the heck, why not be safe and jump to T5”. I thought the same thing until I purchased T5 and tried it. What we found with T5 paste is that it has a much more “runny” consistency. Typical paste sort of holds a rectangular shape when you pull the stencil off. T5 tends to flatten and ooze onto adjacent pads.
The paste is cheap enough that you could order both and see what works for you but after about 2 months worth of experiments, we did arrive at T4 being the “Goldilocks” paste.