Power Swap v2 Boost Layout Part 2


#1

Originally published at: https://contextualelectronics.com/topic/power-swap-v2-boost-layout-part-2/

In part 1 when we made the footprint, it was wrong to not assign the pin numbers to some pieces of the central part of the switcher footprint. This prevented the copper from creating a solid plane. We can go in and select a solid copper connection on a pin by pin basis. This really…


#3

@ChrisGammell Quick question. In this video you show how to do (blind vias?) but Osh Park doesn’t allow blind vias. Should I be worried about this or are the through holes vias ok because it’s still more mass of copper?


#4

Could you clarify what you mean when you say blind? Do I specifically call it out in the video? Most of what we do in the course is through hole

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image credit: https://a-laser.com/laser-drilling/


#5

I was thinking the vias would be solid through the board when you were talking about solid pads. I think I misunderstood.