I ask a strange question. As part of a ramp up to produce small batches, we’re seriously looking at making a custom machine that dispenses paste and stencils it onto each board. There are pros/cons of course but this topic is about how you would test said machine. I do not envisage using real solder paste until the process was fairly well developed and so, in the meantime, what low hazard substance would you use as a solder paste proxy for testing a stencil machine? Toothpaste is not miles off the mark. Probably needs to be:
- Paste but not runny, even when it warms up slightly - we should be able to test alignment and coverage
- Water soluble and not irritating/smelly etc
- Not too abrasive
- only a few components with 0805-0603 scale pads are going to be stencilled and nothing fine pitch
Bonkers and conventional ideas are both welcome. Please don’t question the premise too hard!