Hi! Working on a board that requires large trace widths, as there could be up to 5.0A running through them. There are additional components for the power portion of the circuit that are smd 1206 sized. The trace width used is 120 mils. The copper is only 1 oz thick, and it’s an exposed copper clad board (hence the +11 mils extra, just in case). Calculated via this calculator.
When routing the large traces to the smd components, it causes the entire pad to be ‘covered’ by the trace. I was wondering what the best practice design is for these cases. What I tried was reducing to 60 mils. Could that cause issues? If there are any resources, tips or tricks out there, it would be really appreciated! Thanks
PS: As for the design choice regarding not choosing a copper pour, this is just my preference based on the fabrication method (milled copper clad) and previous experiences. If going with a board made at a fabrication factory, would indeed move +5V and Gnd each to their own plane as a copper pour.